КЛЮЧЕВОЕ СЛОВО
ДРУГИЕ ПРОДУКТЫ
I36DUA-UMW
I36DUA моделируют объединения проекта пиковая работа и около тихой операции.
   
   
I75DUE-CMW
В экструдированного алюминиевого сплава алюминия используется материал и радиальных FIN...
   
   
F1-IACSHA
Excellent thermal performance and ultra silent 1.99.97% pure copper and heat pipe technology provides high thermal
   
   
 >> ГЛАВНАЯ > Последние Новости > ThermalFly I75DUH Heatsink

I75DUH CPU Cooler

The heatsink is made up of two parts - the first an outer ring of extruded aluminum, the center a solid 33mm block of copper. The processor makes direct contact with that copper block, and it in turn spreads the heat energy so the aluminum fins can work more efficiently at transferring it to the surrounding environment. This is the same basic design principle used by Intel RCBFH-3 reference thermal solution.

 

 

 

 ThermalFly Office committed to using lighter weight materials, lower noise and lower manufacturing cost to deliver superior cooling solutions. The result is increased value for our customers with lighter system board loading, quiet working environment and optimal price performance. Price performance, weight performance, and noise performance are our cooling design philosophy.

Click here for more information.

 

Copyright © 2020 ThermalFly Inc. All rights reserved
Add: 8F.-2, No.77, Sec. 1, Sintai 5th Rd., Sijhih Dist., New Taipei City 22101, Taiwan (R.O.C.)
Tel:+886-2-6615-9926 / Fax:+886-2-6615-9927